Title:
トレランスリング、及びトレランスリングをもつアセンブリ
Document Type and Number:
Japanese Patent JP7266088
Kind Code:
B2
Abstract:
A tolerance ring including a substrate, and an overlying layer including at least one of a thermal enhancement layer and a retention layer, the thermal enhancement layer including at least one of (i) Vickers hardness <400 VPN or (ii) a thermal conductivity >100 W/m·K, the tolerance ring being adapted to provide at least one of (a) a thermal transfer between the inner member and the outer member, (b) a coefficient of friction between the retention layer and the outer member, μ1, and a coefficient of friction between the substrate and the outer member, μ2, and where μ1>μ2, or (c) a retention force, Rf, between the inner member and the outer member, and the assembly has an assembly force, Af, and where Rf>0.1 Af, wherein the tolerance ring includes a plurality of projections protruding radially inward or radially outward.
Inventors:
Pickering, Ryuwellin
Application Number:
JP2021502536A
Publication Date:
April 27, 2023
Filing Date:
July 15, 2019
Export Citation:
Assignee:
Saint-Gobain Performance Plastics Rencol Limited
International Classes:
F16D7/02; F16C35/07
Domestic Patent References:
| JP2014139481A | ||||
| JP200838990A | ||||
| JP2017516967A | ||||
| JP2013505411A |
Attorney, Agent or Firm:
Patent Attorney Corporation Otsuka International Patent Office
Yasunori Otsuka
Yasuhiro Otsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Nagakawa Yumitsu
Tomofumi Kinoshita
Patent Attorney Corporation Asamura Patent Office
Yasunori Otsuka
Yasuhiro Otsuka
Shiro Takayanagi
Shuji Kimura
Osamu Shimoyama
Nagakawa Yumitsu
Tomofumi Kinoshita
Patent Attorney Corporation Asamura Patent Office