PURPOSE: To eliminate the need for the wet process of packaging, and to improve the reliability and productivity of a product by executing precious-metal plating or precious-metal plating using a platinum group metallic plating group as foundation to a section in advance, from which an inner lead section is removed, under the state of a lead frame single body before sealing the electronic part.
CONSTITUTION: It is made sure that platinum group metals, such as rhodium, platinum, etc. are proper when it is investigated that a metallic plating later, which is not oxidized at a high temperature and can prevent the thermal diffusion of the blank metals of a lead frame, is formed as a foundation plating layer. When plating treatment is executed before sealing the electronic parts, a gold plating surface is not discolored due to heating when assembling a subchip even in the thickness of gold plating of approximately 0.5W1.5μm and excellent result is obtained, and it is confirmed that rhodium functions as the barrier of the thermal diffusion of the blank metals of the lead frame.
| JP5459985 | Package and electronic device using it, and light emitting device |
| JP2004228427 | MICROWAVE PACKAGE |
| JPS52144275 | MOLD TYPE SEMICONDUCTOR ELEMENT |
AOKI EIJI
KIDA SUSUMU
KANAZAWA ARITERU
| JPS51115775A | 1976-10-12 | |||
| JPS5141961A | 1976-04-08 | |||
| JPS4827756U | 1973-04-04 |
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