Title:
LEAD FRAME MATERIAL
Document Type and Number:
Japanese Patent JPH0610098
Kind Code:
A
Abstract:
PURPOSE: To obtain excellent corrosion resistance, solderability and plating properties in a lead frame material even if its Ni content is reduced by specifying the contents of Ni, Cu and Mo.
CONSTITUTION: The lead frame material is constituted of a compsn. contg., by weight, 32 to 35% Ni, 0.1 to 1.0% Cu and 0.1 to 1.0% Mo (≤1.0% Cu+Mo), and the balance substantially Fe. The electric resistance of this Ni-Fe alloy is higher than that of a 42Ni-Fe alloy, but about by 50% at the maximum, and there is no problem in particular. This allay is melted and is thereafter subjected to forging, machining, hot rolling, surface grinding, cold rolling, vacuum annealing or the like to form its shape into a sheet one.
Inventors:
YAHAGI SHINICHIRO
YAMADA HIROSHI
ISHIDA KAZUHISA
YAMASAKO YOSHIKAZU
OKUMA TAKAMITSU
YAMADA HIROSHI
ISHIDA KAZUHISA
YAMASAKO YOSHIKAZU
OKUMA TAKAMITSU
Application Number:
JP16966192A
Publication Date:
January 18, 1994
Filing Date:
June 26, 1992
Export Citation:
Assignee:
DAIDO STEEL CO LTD
International Classes:
C22C38/00; C22C38/16; H01L23/48; (IPC1-7): C22C38/00; C22C38/16; H01L23/48
Attorney, Agent or Firm:
Sou Suga