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Patent Searching and Data


Title:
THERMAL OVERLOAD RELAY
Document Type and Number:
Japanese Patent JP2010231998
Kind Code:
A
Abstract:

To improve the construction of a resin frame for suppressing thermal interference between heater units by securing high heat shielding performance between partition walls, while reducing the thickness of each of the interphase partition walls by adopting the thermoplastic resin for the resin frame which stores the heater units arranged in R, S, T phases from side to side.

In the thermal overload relay, the heater units 1 of main bimetals 2 connected to the R, S, T phases of a main circuit and an output contact mechanism linked to the main bimetals 2 in the phases are mounted on the boxed resin frame 14 as a molded resin product. Inside the resin frame 14, erected chambers storing the individual heater units 1 in the phases are defined from side to side via the interphase partition walls 14a. Each of the interphase partition walls 14a has a region on the side of a supporting portion supporting at least the base of the heater unit 1, formed with a double wall 14d sandwiching an intermediate air layer 14c, resulting in improved interphase heat insulting performance.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
UCHIYAMA TAKU
TOYAMA KENTARO
TADA SHINJI
MORISHITA FUMIHIRO
FURUHATA YUKIO
Application Number:
JP2009077904A
Publication Date:
October 14, 2010
Filing Date:
March 27, 2009
Export Citation:
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Assignee:
FUJI ELEC FA COMPONENTS & SYS
International Classes:
H01H61/01
Attorney, Agent or Firm:
Yoichi Matsumoto