To provide a suction structure capable of sucking a printed circuit board material by vacuum regardless of thickness or rigidity.

When sucking and holding the board material W, in a thin board material W, since a suction face 9 is flat, there is a plurality of the suction faces, and a deformation resistance of a lip 13 is extremely small, the board material W is vertically sucked in a flush state. In a thick board material W, when there is a warp and even if there is a gap between the suction face 9 and the board material W, since a suction hole 14 periphery is surrounded by the vacuum leakage preventing lip 13 and the lip 13 closely contacts a surface of the board material W in an outer side of the gap, a lip 13 inner space is closed and vacuum suction functions of suction holes 14 act on the board material W. By this, a malfunction of deterioration in a suction function can be resolved, caused by an occurrence of a suction hole 14 incapable of exerting a suction function due to the gap between the board material W and the suction face 9.