Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2022176644
Kind Code:
A
Abstract:
To suppress damage to substrates when transferring substrates from a batch processing section to a single substrate processing section.SOLUTION: A substrate processing method includes the following processes: immersing a plurality of substrates in a chemical solution in a batch processing section; rinsing the substrates with a rinse solution after immersion in the chemical solution in the batch processing section; replacing at least part of the rinse solution in the substrates with IPA in the batch processing section; moving the substrates to a single substrate processing section after the rinse solution is replaced with IPA; and drying the substrates in the single substrate processing section.SELECTED DRAWING: Figure 1
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Inventors:
MATSUNAGA YASUYUKI
Application Number:
JP2021083178A
Publication Date:
November 30, 2022
Filing Date:
May 17, 2021
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
H01L21/304
Attorney, Agent or Firm:
Hidetoshi Yoshitake
Takahiro Arita
Takahiro Arita
Previous Patent: JPWO2022176643
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