Title:
ウェハ用の基板処理装置
Document Type and Number:
Japanese Patent JP7268208
Kind Code:
B2
Abstract:
The invention relates to a substrate handling device for a wafer, a substrate handling system for a wafer and a method for substrate handling. The substrate handling device comprises:- an end effector,- a straightening ring, and- a suction cupThe suction cup is arranged within the straightening ring. At least the straightening ring is releasably attached to the end effector. A first part of the suction cup is connectable to a vacuum supply and a second part of the suction cup is attachable to a substrate by means of reduced pressure provided by the vacuum supply. The suction cup projects from the straightening ring in a normal pressure state. The suction cup is on the same level as the straightening ring in a reduced pressure state, in which the substrate is held by the suction cup, so that the straightening ring contacts the substrate.
Inventors:
Andreas Gleissner
Manuel Ible
Herbert Utzlinger
Manuel Ible
Herbert Utzlinger
Application Number:
JP2021576984A
Publication Date:
May 02, 2023
Filing Date:
July 30, 2020
Export Citation:
Assignee:
SEMSYSCO GmbH
International Classes:
H01L21/677; F16B47/00
Domestic Patent References:
| JP2018157221A | ||||
| JP2017200712A | ||||
| JP6029370A | ||||
| JP10156780A | ||||
| JP2012199282A |
Foreign References:
| US6517130 | ||||
| KR1020110101808A |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Masayo Kayama
Mitsutsugu Sugimura
Masayo Kayama
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