Title:
構造材
Document Type and Number:
Japanese Patent JP4198407
Kind Code:
B2
Inventors:
Koji Tomita
Kari Yi
Kari Yi
Application Number:
JP2002215879A
Publication Date:
December 17, 2008
Filing Date:
June 19, 2002
Export Citation:
Assignee:
Hikari Co., Ltd.
International Classes:
F16B37/04; F16S3/04
Domestic Patent References:
| JP6028324U | ||||
| JP4129913U | ||||
| JP63164614U | ||||
| JP7293536A |
Attorney, Agent or Firm:
Osamu Matsushima
Previous Patent: シリル基含有有機重合体用硬化触媒およびそれを含有する湿気硬化型シリ...
Next Patent: COATING METHOD WITH INTERMETALLIC COMPOUND
Next Patent: COATING METHOD WITH INTERMETALLIC COMPOUND