Title:
傾斜中間層を有するスパッタリングターゲットアセンブリ及び作製方法
Document Type and Number:
Japanese Patent JP6728389
Kind Code:
B2
Abstract:
A sputtering target assembly includes a sputtering target having a rear surface, a backing plate having a front surface, and an interlayer disposed between the target and the backing plate. The interlayer includes a first interlayer portion disposed proximate the target material rear surface, and a second interlayer portion disposed proximate the backing plate front surface. The first interlayer portion is formed of a first mixture containing a first material and a second material and having a higher concentration of the first material than the second material, and the second interlayer portion is formed of a second mixture containing the first material and the second material and having a higher concentration of the second material than the first material. A method of making is also provided.
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Inventors:
Stefan Ferrase
Susan Dee Strothers
Shinrin Sea
Diana El Morales
Susan Dee Strothers
Shinrin Sea
Diana El Morales
Application Number:
JP2018552003A
Publication Date:
July 22, 2020
Filing Date:
March 28, 2017
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
C23C14/34; B22F3/105; B22F3/16; B22F7/08; B23K20/00; F16B11/00
Domestic Patent References:
| JP8269704A |
Foreign References:
| WO2015008864A1 | ||||
| US20060065517 |
Attorney, Agent or Firm:
Shinjiro Ono
Osamu Yamamoto
Toru Miyamae
Motoharu Nakanishi
Toyoji Matsuda
Osamu Yamamoto
Toru Miyamae
Motoharu Nakanishi
Toyoji Matsuda