Title:
SOLDER BALL AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH11207494
Kind Code:
A
Abstract:
To obtain Sn-Pb solder balls without faulty appearance by a method of atomizing in oil and to provide a manufacturing method thereof.
In a method of atomizing in oil in which molten solder is discharged from a nozzle tip into oil heated above the melting point of the solder and the liquid stream of the discharged molten solder is divided into pieces in the oil to obtain solder balls, the composition of the molten solder discharged from the nozzle tip is, by weight, 500-5000 ppm Sb, 36-37% Pb, and the balance Sn with inevitable impurities.
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Inventors:
OKABE YOSHIHIRO
MORIMOTO KEI
MORIMOTO KEI
Application Number:
JP1118598A
Publication Date:
August 03, 1999
Filing Date:
January 23, 1998
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
B23K35/26; B22F9/08; B23K35/40; C22C13/00; H01L21/60; (IPC1-7): B23K35/40; B22F9/08; B23K35/26; C22C13/00; H01L21/60
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