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Patent Searching and Data


Title:
銀粉およびその製造方法
Document Type and Number:
Japanese Patent JP5098098
Kind Code:
B2
Abstract:

To provide a method for manufacturing silver powder by which silver powder having a surface moisture content suitable for conductive pastes in which highly water-soluble organic solvents are used can be manufactured.

The method for manufacturing silver powder in which a reducing agent is added to an aqueous reaction system containing silver ions to precipitate silver particles by reduction is characterized in that: two or more dispersing agents, preferably, e.g. a hydrophobic dispersing agent, such as benzotriazole, stearic acid and oleic acid, and a hydrophilic dispersing agent, such as gelatin and collagen peptide, are added to a slurry-like reaction system before, after or in the course of the reduction precipitation of silver particles.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
Takeshi Fujino
Shinichi Konno
Akira Hirata
Yuki Seiya
Application Number:
JP2006267146A
Publication Date:
December 12, 2012
Filing Date:
September 29, 2006
Export Citation:
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Assignee:
dowa Electronics Co., Ltd.
International Classes:
B22F9/24; B22F1/00; H01B1/00; H01B1/22; H01B13/00
Domestic Patent References:
JP2004265901A
JP2005330529A
JP2006002228A
JP10041112A
JP10030103A
Foreign References:
WO2005088652A1
Attorney, Agent or Firm:
Koichi Okawa