Title:
Semiconductor device and its producing method
Document Type and Number:
Japanese Patent JP6269458
Kind Code:
B2
Abstract:
A semiconductor device includes: a semiconductor element having a solder region and a non-solder region on a first face; a first metal member disposed on the first face of the semiconductor element; a second metal member disposed on a rear face of the semiconductor element; a first solder that connects the solder region of the semiconductor element and the first metal member; and a second solder that connects the rear face of the semiconductor element and the second metal member. At least the second solder provides a melt-bond. A gravity center position of the first metal member coincides with a center position of the semiconductor element in a projection view from a stacking direction.
Inventors:
Sugiura Shun
Tadayoshi Okura
Tadayoshi Okura
Application Number:
JP2014249164A
Publication Date:
January 31, 2018
Filing Date:
December 09, 2014
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/36; B23K1/00; H01L25/07; H01L25/18
Domestic Patent References:
| JP2005116875A | ||||
| JP2012186273A | ||||
| JP2005117009A | ||||
| JP2011233722A | ||||
| JP9232339A |
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Takanori Kubo
Taihei Nonobe
Takanori Kubo
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