Title:
RING FRAME AND PRODUCTION METHOD OF RING FRAME
Document Type and Number:
Japanese Patent JP2023035456
Kind Code:
A
Abstract:
To make it less likely for the paste layer of an adhesive tape to remain when peeling the adhesive tape adhered to a ring frame.SOLUTION: A thin-plate ring frame has an opening in the center, on one surface of which a nickel composite film is arranged in which fine particles of a fluorine compound are dispersed and fixed. A production method of the thin-plate ring frame having the opening in the center includes: performing a degreasing treatment to a stainless-steel frame having the opening in the center; performing a pickling treatment to the stainless-steel frame; performing a nickel strike plating to the stainless-steel frame; performing a nickel polytetrafluoroethylene complex plating to the stainless-steel frame; and forming the ring frame, on the surface of which a nickel polytetrafluoroethylene complex plating layer is formed by cleaning and dehydrating the stainless-steel frame.SELECTED DRAWING: Figure 5
Inventors:
HAYASHI TAKESHI
Application Number:
JP2021142322A
Publication Date:
March 13, 2023
Filing Date:
September 01, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
C25D15/02; H01L21/683
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
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