Title:
RESIN COMPOSITIONS
Document Type and Number:
Japanese Patent JPS523642
Kind Code:
A
Abstract:
PURPOSE: A resin composition with improved thermal resistance, prepared by mixing a crystalline chlorinated polyethylene which is obtained by chlorinating a high-density polyethylene at a temperature immediately lower than that at which the polyethylene begins to melt remarkably with an olefinic resin.
Inventors:
TAKEDA JIYUNICHI
HIGUCHI HIDEOMI
MOTOYAMA KIMIO
HIGUCHI HIDEOMI
MOTOYAMA KIMIO
Application Number:
JP7862575A
Publication Date:
January 12, 1977
Filing Date:
June 26, 1975
Export Citation:
Assignee:
SHOWA DENKO KK
International Classes:
C08L23/00; C08L1/00; C08L7/00; C08L21/00; C08L23/02; C08L23/26; C08L23/28; C08L27/00; C08L33/00; C08L33/02; C08L101/00; (IPC1-7): C08L23/02; C08L23/28