PROCESS LIQUID DISCHARGING VALVE AND SUBSTRATE TREATMENT DEVICE WITH PROCESS LIQUID DISCHARGING VALVE

Japanese Patent JP2016196908

A

PROBLEM TO BE SOLVED: To provide a process liquid discharging valve facilitating adjustment of flow rate of gas at an opening or closing valve operated with gas, and provide a substrate treatment device including the process liquid discharging valve.SOLUTION: A process liquid opening or closing valve 40 moves a diaphragm 46 opening or closing a process liquid flow passage 42 by gas and a speed control valve 60 controls a flow rate of gas supplied to the process liquid opening or closing valve 40. During this controlling operation, an adjusting operator rotates a gas flow rate adjustment dial 67 to move a second valve body 63. Additionally, an amount of rotation of a gas flow rate adjustment dial 67 is taken by a rotating amount detecting gear 68 and the taken amount of rotation is displayed at a display segment 80. The adjusting operator sees the amount of rotation displayed at the display segment 80 and adjusts the gas flow rate, so that adjustment of gas flow rate is facilitated more as compared with that of the conventional method for adjusting it through his or her sensitive manner. As a result, this adjustment can be carried out in short time.SELECTED DRAWING: Figure 2

MATSUDA HIROMITSU
WADA TAKUYA
IMAMURA MASATAKA

JP2015076277A

November 24, 2016

April 02, 2015

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SCREEN HOLDINGS CO LTD

F16K37/00; F16K11/22; F16K31/122; F16K35/02; H01L21/304

Tsutomu Sugiya
Hiroyuki Todaka
Tomohiko Sugitani
Kurihara Kaname

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