Title:
POSITION-AND-SHAPE MEASURING DEVICE FOR SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JPS61287141
Kind Code:
A
Abstract:
PURPOSE:To measure the position and shape of a wafer simultaneously by a single device by a method wherein a wafer is adsorbed on a rotary adsorption table and a contactor of linear displacement detector is brought into contact with the periphery of wafer to perform specified processing in terms of the data on rotational angles of rotary adsorption table as well as the detected data of linear displacement detector corresponding to the former data. CONSTITUTION:The distance L from the rotation center Q to a contact S when a contactor 4a of a linear displacement detector 4 arranged on X axis is brought into contact with the periphery of a wafer 1 on a rotary adsorption table 2 is detected by the linear displacement detector 4 to be transmitted to an A/D converter 7. Besides, a rotational angle theta of the rotary adsorption table 2 at that time is counted by a counter 6. Through these procedures, the rotary adsorption table 2 is turned one time to collect the data on detected values of multiple rotational angles theta and the distances L corresponding thereto. All calculations are processed by a processor 8. When the rotary adsorption table 2 is turned at least one time, the central position and radius of wafer 1 based on Q point and X axis as well as the position and length of orientation flat 1a can be measured.
Inventors:
UEDA RYOHEI
Application Number:
JP13021285A
Publication Date:
December 17, 1986
Filing Date:
June 13, 1985
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/68; H01L21/67; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Masuo Oiwa
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