POLYOXYMETHYLENE RESIN COMPOSITION AND MOLDING - Asahi Kasei Chemicals Corporation

Title:

POLYOXYMETHYLENE RESIN COMPOSITION AND MOLDING

Document Type and Number:

Japanese Patent JP3706024

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a polyoxymethylene resin composition to which a durability and a high damping characteristic are imparted simultaneously without impairing superior friction and abrasion properties of the polyoxymethylene resin.
SOLUTION: This polyoxymethylene resin composition consists of (A) 100 pts.wt. of a polyoxymethylene resin, (B) 1-200 pts.wt. of a polymer compound having a primary dispersion tan δ peak at 60°C or below and a number-average molecular weight of 10,000-500,000, (C) 0.5-30 pts.wt. of a silicone-grafted polyolefin resin and (D) 0-20 pts.wt. of a lubricant.

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Inventors:

Makoto Toki
Hideki Nakamura

Application Number:

JP2000398380A

Publication Date:

October 12, 2005

Filing Date:

December 27, 2000

Export Citation:

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Assignee:

Asahi Kasei Chemicals Corporation

International Classes:

F16C33/12; C08G2/10; C08J5/00; C08K5/00; C08L21/00; C08L53/00; C08L59/02; C08L59/04; C08L71/02; C08L83/10; C08L101/00; C09K3/00; F16H53/00; F16H55/06; (IPC1-7): C08L59/04; C08J5/00; C08L83/10; C08L101/00; C09K3/00; F16C33/12; F16H53/00; F16H55/06

Domestic Patent References:

JP2001200166A

Foreign References:

WO2001032775A1

Attorney, Agent or Firm:

Hideo Takei
Takeshi Shimizu
Joi Ito
Yoshio Narui

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