Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2006056983
Kind Code:
A
Abstract:
To provide a polyamide resin composition having excellent strength, rigidity, low friction, low wearability and heat-resistant aging characteristics, and usable for a sliding member.
The polyamide resin composition comprises (A) 100 pts. wt. polyamide resin and (B) 1-40 pts. wt. inorganic filler having 1-6 Mohs hardness scale and 0.001-10 μm average particle diameter, and is regulated so that the relative viscosity (RV) of the polyamide resin in the polyamide resin composition is 60-300.
Inventors:
SAKUMA TERUAKI
ARAMAKI MASAAKI
ARAMAKI MASAAKI
Application Number:
JP2004239925A
Publication Date:
March 02, 2006
Filing Date:
August 19, 2004
Export Citation:
Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
C08L77/00; C08J5/16; C08K3/00; F16H53/02; F16H55/06