Title:
ポリアミド樹脂組成物、フィルム
Document Type and Number:
Japanese Patent JP6838555
Kind Code:
B2
Abstract:
Provided are: a polyamide resin composition that can yield a polyamide film having excellent thermal durability; and a polyamide film. The polyamide resin composition comprises a polyamide resin, 0.1-5 mass% of an olefinic elastomer, 0.01-1 mass% of an antioxidant, and 0.01-3 mass% of an ionomer resin.
Inventors:
Yabu Naoyasu
Hideo Sano
Hideo Sano
Application Number:
JP2017547801A
Publication Date:
March 03, 2021
Filing Date:
October 25, 2016
Export Citation:
Assignee:
Ube Industries,Ltd.
International Classes:
C08L77/00; C08J5/18; C08K5/00; C08L23/02; C08L23/26
Domestic Patent References:
| JP7276591A | ||||
| JP58023850A | ||||
| JP5064868A | ||||
| JP58029854A | ||||
| JP54028360A |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes