Title:
POLISHING PAD SURFACE PROPERTY MEASUREMENT APPARATUS, POLISHING PAD SURFACE PROPERTY MEASUREMENT METHOD, AND POLISHING PAD SURFACE PROPERTY DETERMINATION METHOD
Document Type and Number:
Japanese Patent JP2022112194
Kind Code:
A
Abstract:
To provide a polishing pad surface property measurement apparatus which can improve measurement accuracy of a surface property of a polishing pad.SOLUTION: A surface property measurement apparatus includes a projection part 32 capable of irradiating a polishing pad 2 with light from a plurality of irradiation angles when the polishing pad 2 is viewed from a polishing surface side of the polishing pad 2, and a light-receiving part 35 capable of receiving reflected light from a plurality of directions reflected on the surface of the polishing pad 2. The surface property measurement apparatus further includes an irradiation direction changing mechanism for changing the light irradiation direction, and the irradiation direction changing mechanism includes a motor for rotating the projection part and the light-receiving part, and a shaft connected to the rotation motor.SELECTED DRAWING: Figure 2
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Inventors:
OSHIMA KOHEI
MATSUO NAONORI
KANEUMA TOSHIFUMI
TAKADA NOBUYUKI
MATSUO NAONORI
KANEUMA TOSHIFUMI
TAKADA NOBUYUKI
Application Number:
JP2021007904A
Publication Date:
August 02, 2022
Filing Date:
January 21, 2021
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B49/12; B24B37/00; B24B37/20; B24B49/18; B24B53/00; G01B11/30; H01L21/304
Attorney, Agent or Firm:
Tetsuya Hirosawa
Yutaro Watanabe
Goto Manabu
Mitsuhiro Kanazawa
Yutaro Watanabe
Goto Manabu
Mitsuhiro Kanazawa