Title:
Polishing pad and its manufacturing method
Document Type and Number:
Japanese Patent JP6315246
Kind Code:
B2
Abstract:
Provided is a polishing pad which is capable of providing a high flatness to a polishing workpiece and suppressing the formation of scratches, and a method therefor. The polishing pad comprises a foamed urethane sheet on the surface which includes closed cells and open cells and which satisfies the following requirements: (1) an open cell ratio is 20-80 vol% where the total volume of closed cells and open cells is taken as 100 vol%, (2) the ratio [tan´ (wet/dry) ratio] of a loss factor tan´ in a water-absorption state to that in a dry state is 1. 3-1. 7, the loss factors being measured according to JIS K7244-4 with an initial load of 20 g at a measuring frequency of 1 Hz at a temperature of 26°C in a tensile mode over a strain range from 0.01 to 0.1%, and (3) the Shore DO hardness according to ASTM D2240 is 60-80.
Inventors:
Mitsunori Itoyama
Daisuke Takahashi
Daisuke Takahashi
Application Number:
JP2014072366A
Publication Date:
April 25, 2018
Filing Date:
March 31, 2014
Export Citation:
Assignee:
Fujibo Holdings Co., Ltd.
International Classes:
B24B37/24; C08G18/00; C08G18/10; H01L21/304
Domestic Patent References:
| JP2013515379A | ||||
| JP2011200946A | ||||
| JP2008188757A | ||||
| JP2011005563A |
Foreign References:
| US20080139684 |
Attorney, Agent or Firm:
Koichi Tsujii
Sadao Kumakura
Atsushi Hakoda
Kenji Asai
Kazuo Yamazaki
Satsuki Ichikawa
Tomoyuki Iwasawa
Sadao Kumakura
Atsushi Hakoda
Kenji Asai
Kazuo Yamazaki
Satsuki Ichikawa
Tomoyuki Iwasawa
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