Title:
PLATING SOLUTION ADDITIVE
Document Type and Number:
Japanese Patent JP2022157257
Kind Code:
A
Abstract:
To provide a plating solution additive having excellent dispersibility in water, eliminating the needs of special preprocessing and reaction because nanocarbon can be co-deposited only by entering a plating solution, and capable of efficiently co-depositing nanocarbon in small amounts.SOLUTION: A plating solution additive contains a flaky carbon whose thickness is 1 to 100 nm and an organic compound including a hydrophobic group with a high affinity between a hydrophilic group and carbon. The plating solution additive contains 0.1 to 100 pts.mass of an organic component including a hydrophobic group with a high affinity between a hydrophilic group and carbon to 1 pt.mass of the flaky carbon.SELECTED DRAWING: None
Inventors:
SAKAMOTO HIROKI
Application Number:
JP2021061378A
Publication Date:
October 14, 2022
Filing Date:
March 31, 2021
Export Citation:
Assignee:
OSAKA GAS CO LTD
International Classes:
C25D15/02; C01B32/00; C25D3/12; C25D3/38
Attorney, Agent or Firm:
Saegusa International Patent Office
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