Title:
低水分伸張特性を有する不織布ジョントテープ
Document Type and Number:
Japanese Patent JP6697018
Kind Code:
B2
Abstract:
The invention is directed to a joint tape for finishing a joint between boards having a nonwoven substrate that does not swell substantially in the presence of water. The invention further provides a method of finishing a joint between boards having the steps of (i) applying a joint tape of the invention to a joint between boards by embedding the joint tape in a first coat of joint compound, (ii) applying a second coat of joint compound over the tape, wherein step (ii) is carried out before the joint tape and joint compound applied in step (i) have substantially dried, and optionally (iii) applying a third fill or finish coat of joint compound over the tape, wherein step (iii) is carried out before the joint tape and second coat have substantially dried.
Inventors:
Imordino, Salvatore, Si.
Stevens, Richard, Bee.
Miller, Charles, Jay.
Neil, Paul, H.
Stevens, Richard, Bee.
Miller, Charles, Jay.
Neil, Paul, H.
Application Number:
JP2018031879A
Publication Date:
May 20, 2020
Filing Date:
February 26, 2018
Export Citation:
Assignee:
United States Gypsum Company
International Classes:
E04F13/07; C09J7/21; D04H1/4218; D04H1/425; D04H1/58
Domestic Patent References:
| JP2000352173A | ||||
| JP2005213339A | ||||
| JP2005511921A | ||||
| JP2007516366A | ||||
| JP5602430B2 |
Attorney, Agent or Firm:
Kimura Mitsuru
Taiji Morikawa
Kei Sakurada
Taiji Morikawa
Kei Sakurada