Title:
NICKEL ELECTROPLATING FILM AND SOLUTION, AND PRODUCTION METHOD OF NICKEL ELECTROPLATING FILM USING NICKEL ELECTROPLATING SOLUTION
Document Type and Number:
Japanese Patent JP2022018659
Kind Code:
A
Abstract:
To provide a plating film with good corrosion resistivity and good plating appearance even when a micro porous nickel plating is thickened.SOLUTION: A nickel electroplating film includes a secondary particle composed of an agglomerate of primary particles. The primary particles are non-conductive particles with a primary-particle average diameter of 1 nm to 50 nm. The secondary particle is an agglomerate with a secondary-particle average diameter of 0.1 μm to 5 μm.SELECTED DRAWING: None
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Inventors:
TOYAMA YURI
YOSHIKAWA JUNJI
YOSHIKAWA JUNJI
Application Number:
JP2020121917A
Publication Date:
January 27, 2022
Filing Date:
July 16, 2020
Export Citation:
Assignee:
OKUNO CHEM IND CO
International Classes:
C25D5/56; C25D15/02
Attorney, Agent or Firm:
Patent Business Corporation Saegusa International Patent Office
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