Title:
【発明の名称】半導体装置用リ―ドフレ―ムの製造方法
Document Type and Number:
Japanese Patent JP2502187
Kind Code:
B2
Inventors:
MATSUKI JUNICHI
Application Number:
JP28902590A
Publication Date:
May 29, 1996
Filing Date:
October 26, 1990
Export Citation:
Assignee:
YAMAGATA NIPPON DENKI KK
International Classes:
H01L23/48; (IPC1-7): H01L23/48
Domestic Patent References:
| JP3152966A | ||||
| JP2230760A | ||||
| JP2156558A | ||||
| JP2138764A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)