Title:
モジュール配電システム
Document Type and Number:
Japanese Patent JP4018850
Kind Code:
B2
Abstract:
A modular electronic assembly and a modular robotic assembly is disclosed. The electronic assembly comprises modules each having power connection plates, and a power distribution controller for dynamically defining the single root power connection plate and branch power connection plates. The robotic assembly comprises a plurality of movable robotic modules, each having actuators externally powered through power connection plates, and at least two dynamically defined branch power connection plates, with each module having a power distribution controller for dynamically defining the single root power connection plate and branch power connection plates. The modules further comprise a constant current power supply connected to the one of the plurality of modules to provide a substantially constant current to all of the plurality of modules connected together by power connection plates.
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Inventors:
Mark Him
Application Number:
JP28665699A
Publication Date:
December 05, 2007
Filing Date:
October 07, 1999
Export Citation:
Assignee:
XEROX CORPORATION
International Classes:
F16S5/00; H02J4/00; B25J9/16
Domestic Patent References:
| JP11154573A |
Foreign References:
| DE4141241A1 | ||||
| US5145130 |
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida
Jun Ishida