Title:
異方性エッチングのための方法と装置
Document Type and Number:
Japanese Patent JP4698024
Kind Code:
B2
Abstract:
There is disclosed a method of treating a substrate material or a film present on the material surface comprising cyclically performing the following steps: (a) etching the material or film; (b) depositing or forming a passivation layer on the surfaces of an etched feature; and (c) selectively removing the passivation layer from the etched feature in order that the etching proceeds in a direction substantially perpendicular to the material or film surface. At least one of the steps (a) or (b) is performed in the absence of a plasma. Also disclosed is an apparatus for performing the method.
More Like This:
Inventors:
Bahadwai, Iyotti, Chiron
Application Number:
JP2000561646A
Publication Date:
June 08, 2011
Filing Date:
July 23, 1999
Export Citation:
Assignee:
Surface Technology Systems PLC
International Classes:
H01L21/302; H01L21/3065; B01J12/00; B01J19/24; B81C1/00; C01B7/24; C07C17/00; H01L21/306; H01L21/311; H01L21/3213
Domestic Patent References:
| JP3276626A | ||||
| JP1232728A | ||||
| JP8306674A | ||||
| JP1316932A | ||||
| JP9181081A | ||||
| JP4061333A | ||||
| JP5136107A | ||||
| JP60154622A |
Attorney, Agent or Firm:
Atsushi Ichito
Reijiro Ichihigashi
Reijiro Ichihigashi