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Patent Searching and Data


Title:
METHOD AND DEVICE OF FORMING THICK FILM
Document Type and Number:
Japanese Patent JP2002093314
Kind Code:
A
Abstract:

To provide a method and device of forming a thick film capable of forming an electrode film with low resistance and a dielectric film with stable dielectric constant and high dielectric strength.

When a substrate 100 with a pre-burning silver electrode film 120 is fed into a burning furnace 10 by a conveyer 20, the most part of the organic material contained in the paste in the film 120 is burned at the area A of normal temperature-450°C, and the burning is promoted due to ozone contained in the atmosphere at the above area A. Further, organic materials and carbon remained in the film 120 are burned at the area B of exceeding 450°C, and organic materials and carbon remained in the film 120 disappear, because the burning reaction is promoted by the ozone still contained in the atmosphere at the area B.


Inventors:
YASUI HIDEAKI
SUGIMOTO KAZUHIKO
HASEGAWA KAZUYUKI
TANAKA HIROYOSHI
Application Number:
JP2000275448A
Publication Date:
March 29, 2002
Filing Date:
September 11, 2000
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01J9/02; H01B19/00; H01J11/22; H01J11/24; H01J11/26; H01J11/34; H01J11/36; H01J11/38; (IPC1-7): H01J9/02; H01B19/00; H01J11/02
Attorney, Agent or Firm:
Shiro Nakajima (1 person outside)