PURPOSE: To prevent generation of chips in a laminate device for contact- bonding a laminated film composed of a continuous band-like substrate and a spreading material layer laid over the former, on a sheet substrate, by cutting the laminated film by a length corresponding to the length of the sheet substrate while heating the laminated film.

CONSTITUTION: A laminated film 19 composed of a band-like substrate made of polyester or the like, a spreading material layer laid over the former and a protecting film 19c with which the upper surface of the spreading material layer is covered, is paid off from a roll thereof supported on a supply roll 2, is fed to a vacuum plate 6 by way of a tension bar 4 after the protecting film 19c is peeled off. Then, the film 19 is cut into file pieces having a predetermined length by a film keeper 9 and a disc-like cutter 20 in cooperation, and is then heated by a heater 17 and an infrared heater 18 before it is fed into a station for film-application. Further, in this station, the films 19' are heated and contact-bonded to the top and bottom surfaces of the sheet substrate 21 by means of a pair of upper and lower laminate rolls 10 through the intermediary of its spreading material surface.