Title:
積層セラミック電子部品の製造方法
Document Type and Number:
Japanese Patent JP7413033
Kind Code:
B2
Abstract:
To provide a manufacturing method for a multilayer ceramic electronic component, capable of improving production efficiency with respect to formation of a side margin part.SOLUTION: A manufacturing method for a multilayer ceramic electronic component includes a step of pasting a first side surface of a ceramic laminate chip on a first adhesive sheet, the ceramic laminate chip having a plurality of internal electrodes laminated in a first axis direction and exposed from the first side surface and a second side surface that face a second axis direction orthogonal to the first axis direction. A side margin part is formed on the second side surface. The side margin part's surface facing the second axis direction is pasted on a second adhesive sheet. Applying tension in a direction separating from the first side surface to the first adhesive sheet by bending the first adhesive sheet along a projecting tip of a peeling jig in a state in which the tip is made to be close to the first side surface in the second axis direction makes the first adhesive sheet be peeled from the first side surface of the ceramic laminate chip.SELECTED DRAWING: Figure 12
Inventors:
Yosuke Sato
Application Number:
JP2020004456A
Publication Date:
January 15, 2024
Filing Date:
January 15, 2020
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01G4/30; H01G13/00
Domestic Patent References:
| JP11045934A | ||||
| JP2016025151A | ||||
| JP2012209538A | ||||
| JP2013182982A | ||||
| JP2019106528A | ||||
| JP2011228626A |
Attorney, Agent or Firm:
Shuhei Katayama
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