Title:
ロジックプレート
Document Type and Number:
Japanese Patent JP4737891
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To aim at a mass production and cost reduction of a logic plate used for a fixed unit assembling pipes and wires in an apparatus and an integral unit capable of transporting. SOLUTION: The logic plate comprises a plate 2 in which a groove 1 to be set as a passage of fluid is formed by pressing, and a plate 3, which is installed by equipment 5 and a component 5a, or equipment 5 or a component 5a, forming a connecting-through hole 11 opened to the equipment 5 and component 5a, or the equipment 5 or component 5a. The logic plate is formed by connecting together the plate 2 and plate 3 so that the equipment 5 and component 5a, or the equipment 5 or component 5a are fastened by the groove 1 and connecting-through hole 11.
Inventors:
Harutaro Hidaka
Michio Tsukamoto
Michio Tsukamoto
Application Number:
JP2001267095A
Publication Date:
August 03, 2011
Filing Date:
September 04, 2001
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
F15C5/00; F16K27/00; B23K20/12; F15B11/00; H01M8/04; H01M8/06
Domestic Patent References:
| JP8035506A | ||||
| JP49042389U | ||||
| JP9220658A | ||||
| JP11197855A |
Foreign References:
| GB885101B | ||||
| US3461900 | ||||
| US3814126 | ||||
| US3646963 | ||||
| US2244475 |
Attorney, Agent or Firm:
Toshiro Mitsuishi
Tadahiro Mitsuishi
Yasuyuki Tanaka
Tadahiro Mitsuishi
Yasuyuki Tanaka