Title:
LIQUID METAL RELAY
Document Type and Number:
Japanese Patent JP2010061886
Kind Code:
A
Abstract:
To achieve improvement in productivity and stability of a liquid metal relay action by employing a structure to introduce an optimal amount of liquid metal for a liquid metal relay action.
In the liquid metal relay provided with a passage formed of two substrates stuck together, a plurality of penetrating electrodes arranged with a specific distance communicated with the passage from the surface of the substrates, a first and a second gas chambers arranged connected with either end of the passage, and a heater for heating the gas enclosed in the first and the second gas chambers, a quantitative determination chamber is arranged for introducing a specific amount of liquid metal into the passage in the substrates.
Inventors:
KOINO TOMOHITO
WATANABE TETSUYA
SUZUKI YOSHITAKA
WATANABE TETSUYA
SUZUKI YOSHITAKA
Application Number:
JP2008224373A
Publication Date:
March 18, 2010
Filing Date:
September 02, 2008
Export Citation:
Assignee:
YOKOGAWA ELECTRIC CORP
International Classes:
H01H61/00; H01H29/04; H01H61/013