Title:
パーソナルケア製品向け電子サブアセンブリの組立方法
Document Type and Number:
Japanese Patent JP6680874
Kind Code:
B2
Abstract:
A method of assembling an electronic subassembly for a personal care product by manufacturing a hollow housing defining a chamber having a first open end and an opposing second open end. A rigid end of a first circuit board is inserted into the first open end of the housing. A second circuit board subassembly having a second circuit board is inserted into the chamber through the second open end. The first circuit board is connected to the second circuit board within the chamber of the housing.
More Like This:
| JP2001053474 | MOUNTING STRUCTURE OF ELECTRONIC COMPONENT |
| JPS62254498 | BOARD SUPPORTING FRAME |
Inventors:
Jürgen Behrent
Norbert Broemse
Yvonne shawl
Klaus Huebach
Fred schnuck
Norbert Broemse
Yvonne shawl
Klaus Huebach
Fred schnuck
Application Number:
JP2018517518A
Publication Date:
April 15, 2020
Filing Date:
September 30, 2016
Export Citation:
Assignee:
THE GILLETTE COMPANY LLC
International Classes:
H05K7/14; B26B21/48
Domestic Patent References:
| JP62142869U | ||||
| JP2009506822A | ||||
| JP6619511B2 |
Foreign References:
| US20030226258 | ||||
| WO2015108801A1 |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office