Title:
HIGH-FREQUENCY GROUNDING DEVICE AND VACUUM VALVE HAVING HIGH-FREQUENCY GROUNDING DEVICE
Document Type and Number:
Japanese Patent JP2022177825
Kind Code:
A
Abstract:
To provide an improved high-frequency grounding device for a vacuum valve of a vacuum chamber system, for avoiding undesired plasma discharges in the vacuum chamber system.SOLUTION: A high-frequency grounding device (40) for use with a vacuum valve has a grounding strap (42) having a first end (41) and a second end (43) made of a conductive material for discharging electrical charges occurring on the vacuum valve, where the first end is connected to a valve closure of the vacuum valve, and the second end is connected to a component of a vacuum chamber system. The high-frequency grounding device has a correction impedance, where the grounding strap is coupled to the correction impedance so that an oscillation circuit comprising the grounding strap and the correction impedance is formed, and the correction impedance has a first element for shifting a resonant frequency of the oscillation circuit and/or a second element for reducing the quality of the oscillation circuit.SELECTED DRAWING: Figure 5
Inventors:
ARTHUR BUECHEL
ADRIAN WEITNAUER
ADRIAN WEITNAUER
Application Number:
JP2022080905A
Publication Date:
December 01, 2022
Filing Date:
May 17, 2022
Export Citation:
Assignee:
VAT HOLDING AG
International Classes:
F16K51/00; F16K3/18; H01R4/64
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Taku Morita
Junichi Maekawa
Hideo Nagashima
Ueshima class
Taku Morita
Junichi Maekawa
Hideo Nagashima
Ueshima class