Title:
HIGH-DENSITY MULTI-HOLE SPACER
Document Type and Number:
Japanese Patent JP3396760
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a high-density multi-hole spacer which can reduce the material per the number of holes per unit pipe line and can enhance the strength more than laying a single pipe, and enables cables to be laid stably and easily, forming a small-diameter spacer within a tube.
SOLUTION: This high-density multi-hole spacer includes a tube main body where a plurality of pipe lines are made inside in the axial direction of a pipe so as to store a plurality of cables different in diameter, a pipe coupling groove which is made long in the axial direction of the above tube main body outside the pipe main body, a binding hole which is made through from the wall face of the pipe coupling groove to the end face of the pipe main body, a coupling means which couples the adjacent pipe main bodies, being passed in the binding holes, and a shifting means which can shift the above pipe main body only in the pulling direction.
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Inventors:
Lee Ji Yeon
Roh Ryu
Xu Ming Yu
Roh Ryu
Xu Ming Yu
Application Number:
JP2000382436A
Publication Date:
April 14, 2003
Filing Date:
December 15, 2000
Export Citation:
Assignee:
Korea Electric Communications Company
International Classes:
F16L1/00; F16L7/00; H02G1/06; H02G3/04; H02G3/06; H02G9/06; (IPC1-7): H02G1/06; F16L1/00; H02G9/06
Domestic Patent References:
| JP8251788A | ||||
| JP5258633A | ||||
| JP7119864A | ||||
| JP57175535U | ||||
| JP5857221U | ||||
| JP63156527U |
Attorney, Agent or Firm:
Eiji Saegusa (8 others)