Title:
加熱装置及びこれを用いた半導体製造装置
Document Type and Number:
Japanese Patent JP6545438
Kind Code:
B2
Inventors:
Koji Ota
Application Number:
JP2014116770A
Publication Date:
July 17, 2019
Filing Date:
June 05, 2014
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H05B3/40; F16L53/35; H01L21/3065; H01L21/31; H05B3/28; H05B3/48
Domestic Patent References:
| JP8255681A | ||||
| JP7008460U | ||||
| JP61143981A |
Foreign References:
| US20070212037 |
Attorney, Agent or Firm:
Yoshiaki Anzai