Title:
配管用加熱装置
Document Type and Number:
Japanese Patent JP7443149
Kind Code:
B2
Abstract:
To provide a heating device that can improve heat transfer efficiency from a heater to a pipe.SOLUTION: A heating device comprises a first metal plate 1 and a second metal plate 2 comprising inner surfaces 1a and 2a having a shape along an outer surface of a pipe 100 respectively, a first heat insulating material 5 and a second heat insulating material 6 arranged on the outside of the first metal plate 1 and the second metal plate 2 respectively, and a first heater 7 and a second heater 8 attached to the first metal plate 1 and the second metal plate 2 respectively.SELECTED DRAWING: Figure 1
More Like This:
JP2001518425 | [Title of Invention] Hydraulic Brake System for Automobiles |
JP5283758 | Heat transfer device |
WO/2004/105103 | SEMICONDUCTOR MANUFACTURING DEVICE AND ITS HEATING UNIT |
Inventors:
Yu Segawa
Tomoyoshi Irie
Tadashi Ohbo
Takaaki Arai
Tomoyoshi Irie
Tadashi Ohbo
Takaaki Arai
Application Number:
JP2020079059A
Publication Date:
March 05, 2024
Filing Date:
April 28, 2020
Export Citation:
Assignee:
Ebara Corporation
International Classes:
F16L53/35; F16L59/02
Domestic Patent References:
JP3124489U | ||||
JP44003312B1 | ||||
JP8303978A | ||||
JP3084287A | ||||
JP55028111U | ||||
JP2013500451A | ||||
JP58189888U | ||||
JP2007292199A | ||||
JP9273698A | ||||
JP2007002986A |
Foreign References:
US20140373954 |
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa