Title:
HEAT TRANSFER PIPE PANEL
Document Type and Number:
Japanese Patent JP2753176
Kind Code:
B2
Abstract:
PURPOSE: To provide a safe supporting of a heat transfer pipe panel of a heat exchanger when an excessive external force is applied to the panel in a horizontal direction.
CONSTITUTION: A plurality of heat transfer pipes 12 are connected by some supporting plates 13 arranged at intermediate portions of both headers 11 and 14 so as to constitute a heat transfer pipe panel. Both side surfaces of the heat transfer pipe panel are provided with panel side plates 20a and 20b extending substantially from the upper header 11 to the lower header 14.
Inventors:
SHIMADA HIDEAKI
NAGASHIMA TAKAYUKI
NAGASHIMA TAKAYUKI
Application Number:
JP10080592A
Publication Date:
May 18, 1998
Filing Date:
April 21, 1992
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
F22B1/18; F22B37/20; (IPC1-7): F22B1/18; F22B37/20
Domestic Patent References:
JP60176302U |
Attorney, Agent or Firm:
Suyama Saichi
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