Title:
HEAT SINK FOR ELECTRONIC DEVICE, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR LASER MODULE EMPLOYING THE HEAT SINK
Document Type and Number:
Japanese Patent JP3841633
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat sink, having a certain heat dissipation direction (heat conducting direction) and a thermal expansion coefficient which closely resembles that of an electronic device, a board for mounting an electronic device or a container for housing an electronic device, and to provide a method for manufacturing the same.
SOLUTION: The heat sink 10 is constructed with through-holes 12 formed on a substrate 11 being made of a material with a low thermal expansion coefficient, which comprises a copper-tungsten alloy or a copper-molybdenum alloy having the small content of copper and the large content of tungsten or molybdenum. The through-holes 12 are filled with a high heat conducting material 13, comprising a copper-tungsten alloy or a copper-molybdenum alloy which has the large content of copper and the small content of tungsten or molybdenum. Thus, the heat can be conducted in the axial direction of the through-holes 12.
Inventors:
Katsunori Suzuki
Kensaburo Iijima
Shunji Hoshi
Kensaburo Iijima
Shunji Hoshi
Application Number:
JP2000314981A
Publication Date:
November 01, 2006
Filing Date:
October 16, 2000
Export Citation:
Assignee:
Yamaha Corporation
International Classes:
H01L23/36; H05K7/20; B22F7/06; F28F13/00; H01L21/48; H01L23/373; H01L23/38; H01L35/00; H01S5/024; (IPC1-7): H01L23/373; H01S5/024; H05K7/20
Domestic Patent References:
| JP4215462A | ||||
| JP9232485A | ||||
| JP2000196269A | ||||
| JP10173104A | ||||
| JP10200208A | ||||
| JP7211818A | ||||
| JP6334074A |
Foreign References:
| WO2000013823A1 |
Attorney, Agent or Firm:
Yasuo Asami
Hideo Takahashi
Yoshitaka Takeyama
Takamori Suzuki
Hideo Takahashi
Yoshitaka Takeyama
Takamori Suzuki