Title:
電子部品の製造方法及びペースト塗布装置
Document Type and Number:
Japanese Patent JP7398122
Kind Code:
B2
Abstract:
This paste application apparatus (10) comprises a first dip layer formation part (20) and a second dip layer formation part (30) that is arranged at a distance D from the first dip layer formation part, the distance D being variable. The first dip layer formation part comprises N through holes (22), in each of which a dip layer (102) of a conductive paste is formed. Each one of the N through holes comprises a first open end (23) through which excess conductive paste (102B) applied to an end (2) of an electronic component main body (1) is removed by scraping in a state where the conductive paste (102B) applied to the end (2) is connected to the dip layer (102). The second dip layer formation part (30) is provided with a conductive paste pool (101) that is to be connected to the dip layers (102) via respective second open ends (24) of the N through holes (22).
Inventors:
Eiji Sato
Hitoshi Sakamoto
Hitoshi Sakamoto
Application Number:
JP2021093759A
Publication Date:
December 14, 2023
Filing Date:
June 03, 2021
Export Citation:
Assignee:
Creative Coatings Co., Ltd.
International Classes:
H01G4/30; H01G13/00
Domestic Patent References:
| JP2007013214A | ||||
| JP2021057448A | ||||
| JP9293650A | ||||
| JP9162084A |
Attorney, Agent or Firm:
Hajime Inoue
Noboru Takekoshi
Yasushi Kuroda
Noboru Takekoshi
Yasushi Kuroda