ELECTRONIC COMPONENT MANUFACTURING DEVICE AND ELECTRONIC COMPONENT MANUFACTURING METHOD

Japanese Patent JP2023177097

A

To provide an electronic component manufacturing device that easily and reliably processes the surface of a chip by laser beam irradiation.SOLUTION: A manufacturing device MD1 includes a rotating portion 30 that rotates around a rotation axis Ax1, a holding portion 40 that holds a chip 1 and is arranged in the rotating portion 30 so as to rotate together with the rotating portion 30 around the rotation axis Ax1, a laser irradiation portion 10 located at predetermined rotation angle positions RP1 and RP2 of the rotation portion 30 and irradiating with the laser beam L1, and a control portion CT1 that controls the respective drives of the rotating portion 30, the holding portion 40, and the laser irradiation portion 10. The control portion CT1 controls the drive of the rotating portion such that the holding portion 40 holding the chip 1 is positioned at predetermined rotational angle positions RP1 and RP2, and controls the respective drives of the holding portion 40 and the laser irradiation portion 10 such that the laser irradiation portion 10 irradiates the predetermined surface 1s with the laser beam L1 at predetermined rotation angle positions RP1 and RP2.SELECTED DRAWING: Figure 1

INOUE YORIYUKI
SATO HIDEKATSU
ONO KEI
ITO TAKESHI
SABAYASHI YUTO
SUZUKI SHUSUKE

JP2022089811A

December 13, 2023

June 01, 2022

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TDK CORP

H01G13/00; B23K26/00; B23K26/142; B23K26/70; H01G4/30

Yoshiki Hasegawa
Yoshiki Kuroki
Takashi Mikami

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