Title:
ディップ処理装置およびこれを用いた電子部品の製造方法
Document Type and Number:
Japanese Patent JP7405011
Kind Code:
B2
Abstract:
To provide a dip processing device in which pores are less likely to occur in a baked body of a paste.SOLUTION: A dip processing device 101 includes a container 2 for storing a paste 1, a cage 51 capable of holding a component 10, and a drive unit 4 capable of displacing the cage 51 so that the component 10 held by the cage 51 can move forward and backward relative to a liquid level 1u of the paste 1. The cage 51 is capable of holding the component 10 in a state where a lower end surface of the component 10 is tilted with respect to the liquid level 1u.SELECTED DRAWING: Figure 1
Inventors:
Hiroyuki Aoyama
Mikio Takeno
Junya Tanaka
Mikio Takeno
Junya Tanaka
Application Number:
JP2020104576A
Publication Date:
December 26, 2023
Filing Date:
June 17, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G13/00; H01F27/29; H01F41/10; H01G4/30
Domestic Patent References:
| JP8316107A | ||||
| JP6260377A |
Foreign References:
| WO2016027659A1 |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
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