Title:
半導体パッケージ用硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP5820761
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable resin composition for a package of a light-emitting diode having a high heat resistance and a high light resistance as well as an excellent transfer molding property.SOLUTION: A curable resin composition for a semiconductor package includes: (A) a polyhedral-structure polysiloxane-modified body obtained by modifying a compound (b) having a hydrosilyl group with respect to a polyhedral-structure polysiloxane-based compound (a) having an alkenyl group, the hydrosilyl group being capable of causing a hydrosilylation reaction with the ingredient (a); (B) a non-straight chain polysiloxane having at least one alkenyl group; and (C) a polysiloxane having at least one alkenyl group and also containing at least one aryl group.
Inventors:
Shinya Mizuta
Takanao Iwahara
Takanao Iwahara
Application Number:
JP2012081838A
Publication Date:
November 24, 2015
Filing Date:
March 30, 2012
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08L83/05; C08G77/38; C08K3/22; C08K3/36; C08L83/07; H01L23/02; H01L33/56
Domestic Patent References:
| JP2006233155A | ||||
| JP2010095620A | ||||
| JP2012012556A | ||||
| JP2011213950A | ||||
| JP2011105883A | ||||
| JP2012012557A |
Attorney, Agent or Firm:
Atomi International Patent Office