Title:
集積回路のための冷却装置
Document Type and Number:
Japanese Patent JP2007512468
Kind Code:
A
Abstract:
The micro-pump has a flexible membrane (6) that deforms when it contacts a conducting layer (3) and when a control circuit (V) applies a voltage. The volume of air pocket located between the membrane and the layer decreases when the membrane is deformed in order to displace air towards an air duct (4). The membrane is separated from the layer when the circuit stops applying the voltage. Independent claims are also included for the following: (a) an integrated circuit having a micro-pump (b) a method for forming a micro-pump in the integrated circuit (c) a method for actuating a micro-pump.
Inventors:
Bouche Guillaume
Application Number:
JP2006540554A
Publication Date:
May 17, 2007
Filing Date:
November 12, 2004
Export Citation:
Assignee:
STMicroelectronics Society Anonymous
International Classes:
F04B45/047; B81B3/00; F04B43/04; F15C5/00
Attorney, Agent or Firm:
Keiichi Yamamoto