Title:
高温配管の冷却装置
Document Type and Number:
Japanese Patent JP6615985
Kind Code:
B2
Abstract:
In a cooling device for a high temperature pipe, a high temperature pipe is efficiently cooled, and cooling performance is improved. A cooling device (10) for a high temperature pipe that cools a surface to be cooled (104) of a pipe (100) as a high temperature pipe includes: a cooling medium supply header (11) that is disposed so as not to shield heat dissipation by radiation from the surface to be cooled (104) to the periphery, and allows a cooling medium to flow out toward the surface to be cooled (104); and a cooling medium supply device (12) that supplies the cooling medium to the cooling medium supply header (11).
Inventors:
Takeshi Matsuo
Fumitoshi Sakata
Yuichi Kanamaki
Yuki Mukumoto
Daigo Watanabe
Chikako Kato
Junichi Ozawa
Junki Shiroyama
Kurose Saihiro
Takahiro Fujimori
Hiroyuki Oyama
Fumitoshi Sakata
Yuichi Kanamaki
Yuki Mukumoto
Daigo Watanabe
Chikako Kato
Junichi Ozawa
Junki Shiroyama
Kurose Saihiro
Takahiro Fujimori
Hiroyuki Oyama
Application Number:
JP2018507154A
Publication Date:
December 04, 2019
Filing Date:
February 23, 2017
Export Citation:
Assignee:
Mitsubishi Hitachi Power Systems Co., Ltd.
International Classes:
F16L53/70
Domestic Patent References:
| JP2015045619A | ||||
| JP5231586A |
Attorney, Agent or Firm:
Noriharu Fujita
Miori Takao
Kawakami Miki
Miori Takao
Kawakami Miki