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Title:
変形自在パッドを備えたコンポーネント
Document Type and Number:
Japanese Patent JP6434417
Kind Code:
B2
Abstract:
A component (10) is adapted for contact with a mating component (50) during attachment of the components to one another to form a related assembly in which a deformable pad (26) or pads improve stress distribution. The component includes a body having an interface surface in which the body is adapted to be contacted with the mating component at the interface surface of the body. One or more deformable pads are formed in the interface surface. Each deformable pad has a top surface that is offset outwardly from the interface surface relative to the body and a groove surrounding the deformable pad that is offset inwardly from the interface surface relative to the body.

Inventors:
Sav Virginiu-Adrian
Gayman Timothy Yi.
Kible Alan
Laughlin Timothy
Application Number:
JP2015542872A
Publication Date:
December 05, 2018
Filing Date:
November 18, 2013
Export Citation:
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Assignee:
GK N Sinter Metals, LLC
International Classes:
F16C9/00; F16C35/02
Domestic Patent References:
JP2012501410A
JP2002513123A
JP7305716A
JP201013991A
JP10238531A
JP8188802A
Foreign References:
US20110158569
US6431759
Attorney, Agent or Firm:
Fumio Takino
Toshiaki Tsuda
Yasuhiro Fukuda