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Patent Searching and Data


Title:
CIRCUIT MATERIAL AND CIRCUIT MATERIAL FORMING METHOD
Document Type and Number:
Japanese Patent JP2008092726
Kind Code:
A
Abstract:

To provide a circuit material forming method that is excellent in workability without need to separately apply resist processing to a bus-bar while forming a high-current circuit part with the bus-bar separately from a copper-foil pattern of a printed circuit board.

A circuit material is stored in an on-vehicle electrical junction box. The bus-bar, in which an insulating sheet made of a prepreg material is stuck onto at least the face opposite to the printed circuit board, is fixed on the surface of the printed circuit board having a copper-foil pattern via an adhesive sheet. A high-current circuit is formed of the bus-bar. Circuits other than the high-current circuit are formed of the copper-foil pattern. At least a part of the bus-bar is fixed at a lamination position on a part where at least a part of the copper-foil pattern is exposed while interposing the adhesive sheet. Each terminal pin is inserted into the lamination position. Each terminal pin is connected to the bus-bar and the copper-foil pattern by soldering.


Inventors:
IDO JUNJI
SAKA YUJI
ONIZUKA TAKAHIRO
Application Number:
JP2006272753A
Publication Date:
April 17, 2008
Filing Date:
October 04, 2006
Export Citation:
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Assignee:
SUMITOMO WIRING SYSTEMS
International Classes:
H02G3/16; H05K7/06
Attorney, Agent or Firm:
Kazumi Owada