Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BOND MOLDING OF GRANULAR MATERIAL
Document Type and Number:
Japanese Patent JPH09225916
Kind Code:
A
Abstract:

To manufacture a low density, soft molding including an air layer based on a granular material as a raw material.

A granular material with an average grain size of about 8mm containing a urethane granule or fiber and a 5-10mm fibrous composite binder (melting point: 110°C and 240°C) are mixed using a mixer 1, and this mixture of a thickness larger than specified is supplied onto a molding die K by a fiber laminator 3. An excess mixture is removed by a thickness adjuster 4, then is heated to 150-180°C in an oven 5 and thereby, the surface of the composite binder is melted. After that, the mixture is pressed by a cooling press 6 to be molded into a specified form, and at the same time, the molding is cooled by a cold air. In addition, the granular material is crosslinked with the composite binder to secure the maintenance of the form of the molding. The molding consists of numerous granular materials crosslinked with the fibrous composite binder, and is of the soft quality and low density including an air layer.


Inventors:
NARUSE TORU
MATSUHIRO SHINJI
SUGIGUCHI TAKETSUGU
KANDA MITSUMASA
KAJIWARA TAKUJI
TSUJITA IKUSHI
Application Number:
JP3479896A
Publication Date:
September 02, 1997
Filing Date:
February 22, 1996
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
CHIYUUGAI KK
TOYOTA MOTOR CORP
International Classes:
F16L59/02; B28B1/52; B28B3/02; B29C43/34; (IPC1-7): B28B3/02; B28B1/52; F16L59/02
Attorney, Agent or Firm:
Kenji Ishiguro