Title:
耐バイオフィルム医療用インプラント
Document Type and Number:
Japanese Patent JP7050724
Kind Code:
B2
Abstract:
A method of incorporating silver and/or copper into a biomedical implant includes: providing an implant having an outer surface; depositing silver and/or copper onto the outer surface of the implant; diffusing the silver and/or copper into a subsurface zone adjacent the outer surface; and oxidizing or anodizing the implant after the diffusion step to form an oxidized or anodized layer that contains at least some amount of elemental silver, elemental copper or silver or copper ions or compounds.
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Inventors:
Vivek Dee Power
John Rose
Carolyn Weaver
John Rose
Carolyn Weaver
Application Number:
JP2019129421A
Publication Date:
April 08, 2022
Filing Date:
July 11, 2019
Export Citation:
Assignee:
Smith and Nephew Incorporated
International Classes:
A61L27/30; A61L27/04; A61L27/40; A61L27/54; C23C10/02; C23C10/28; C25D11/34
Domestic Patent References:
| JP2005523079A | ||||
| JP2008194463A | ||||
| JP2010515513A | ||||
| JP2010540079A |
Foreign References:
| US20100326835 | ||||
| WO2007066669A1 |
Other References:
Wen, M. et al.,Applied Surface Science,2011年,Vol. 257, Issue 11,pp. 4836-4843
Attorney, Agent or Firm:
Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe
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