Title:
ADHESIVE STRUCTURE
Document Type and Number:
Japanese Patent JP2023115710
Kind Code:
A
Abstract:
To provide an adhesive structure that is less prone to degradation or deterioration due to heat, and also has high adhesive strength.SOLUTION: An adhesive structure has its surface composed, at least partially, of an inorganic material. The surface has an elastic modulus in the range of 0.01 GPa to 50 GPa. Using a nanoindenter to press a spherical indenter with a diameter of 40 μm into the surface at a pressing depth of either 10 nm or 20 nm, the adhesive force is 35 N/cm2 or higher.SELECTED DRAWING: Figure 1
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Inventors:
MAENO YOHEI
Application Number:
JP2022018076A
Publication Date:
August 21, 2023
Filing Date:
February 08, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
C09J5/00; F16B11/00
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Onami Kazunori
Mitsuo Teramoto
Fumihiro Hosokawa
Onami Kazunori
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